NSE-listed companies building India's semiconductor ecosystem — from OSAT packaging and ASIC chip design to electronics manufacturing services feeding the chip supply chain.
Sectors represented: Information Technology, Capital Goods
This approach. emphasizes predictive maintenance, equipment analysis, and leveraging insights from generative AI to enhance manufacturing. processes. As the demand for sophisticated Generative AI chips grows, there is an increase in the adoption of advanced packaging. and testing technologies such as 2.5D and 3D integration. anufacturing. processes.
Crafting reliable circuits for robust performance. Custom Cables & Harnesses. Bespoke wiring solutions for your unique needs. 12INVESTOR PRESENTATION ms and. smooth performance. Thru-Hole PCB Assembly. Crafting reliable circuits for robust performance. Custom Cables & Harnesses. Bespoke wiring solutions for your unique needs. 12INVESTOR PRESENTATION. MANUFACTURING. PROCESS. Raw Material Sourcing.
MACHINES - TESTING AN ROOM ENVIRONMENT. MACHINES – CLASS10K. (FRONT OF THE LINE). MACHINES – CLASS100K. (END OF THE LINE). CONFIDENTIAL – SAHASRA GROUP. CONFIDENTIAL – SAHASRA GROUP. MACHINES - TESTING. Quality is an integral part of the. product at Sahasra. Semiconductors, to ensure the. same we have the latest state of. the art equipment for the testing. of the product before it is. shipped.
Method of making. interconnects between. the Die /IC Chips and its. package or lead frame. This connects the chip to. the lead frame with a. thin gold wire. Chips are very delicate. products that can be. affected by scratches,. shocks, dust, and. magnetism. IC Chips and its. package or lead frame. This connects the chip to. the lead frame with a. thin gold wire. Chips are very delicate.
The market size & growth. 2 sectors. $200Bn+investedinU.S.semiconductor. capacity,bolsteredbyglobalgovernment. supportandmajorfabinvestments. The recovery of semiconductor market after periodic downturns. The market size & growth. 2. © CYIENT 2024| Confidential. ASICS: ~3x faster growth than general purpose chips, driven by IT/OT integration. Global ASIC. Market 2031. $51.0 Bn. Global. Market 2023...
MosChip supports customers across discrete semiconductor design engagements and lull-cycle turnkey. programmes. SINESS UMI rs. 0. Silicon Engineering Services. . . 0. From specification to validated silicon. MosChip supports customers across discrete semiconductor design engagements and lull-cycle turnkey. programmes.
OUR PRECISION. ENGINEERING FORTRESS. State-of-the-art facilities. 17. PUNE R&D & CCS PROJECT (EST. shop. . Inhouse R&D and Innovation. . Inhouse Reliability Testing. . Inhouse Tooling and Design. 16. 06.b. OUR PRECISION. ENGINEERING FORTRESS. State-of-the-art facilities. 17. PUNE R&D & CCS PROJECT (EST. 2026). 06.c. Purpose-built for forward integration into higher-value.
CPPICS at IIT Madras. izmo Microsystems has served as the designated. Photonic IC Packaging Partner at the Centre for. Programmable Photonic Integrated Circuits and d facility. development. CPPICS at IIT Madras. izmo Microsystems has served as the designated. Photonic IC Packaging Partner at the Centre for. Programmable Photonic Integrated Circuits and.
India or elsewhere, all kinds of mechanical, electrical, electronic, electromechanical and composite parts,. components, assemblies and hardware, including connectors, cable assemblies, moulds, dies, tooling and. fixtures, made from any metal, polymer, ceramic, composite or other material and by any manufacturing,.
Manufacturing, IT Hardware, Telecom,. and White Goods, among others. o Scheme for Promotion of Manufacturing. of Electronic Components and. Semiconductors (SPECS). o Electronics Manufacturing Clusters (EMC 2.0). o Indian Semiconductor Mission (ISM) ite Goods, among others. o Scheme for Promotion of Manufacturing. of Electronic Components and. Semiconductors (SPECS).