NSE-listed companies building India's semiconductor packaging and OSAT ecosystem — from greenfield assembly-and-test facilities to fabless ASIC design houses and advanced packaging specialists.
Sectors represented: Capital Goods, Information Technology
Inner Layer Manufacturing Process. Outer Layer ImagePattern PlateEtchingVia Hole PluggingSoldermaskSurface Finish. Outer Layer Manufacturing Process. Removing the unwanted. copper from the panel. The inner layers are. “stacked” together with ter Layer ImagePattern PlateEtchingVia Hole PluggingSoldermaskSurface Finish. Outer Layer Manufacturing Process. Removing the unwanted. copper from the panel.
The market size & growth. 2 sectors. $200Bn+investedinU.S.semiconductor. capacity,bolsteredbyglobalgovernment. supportandmajorfabinvestments. The recovery of semiconductor market after periodic downturns. The market size & growth. 2. © CYIENT 2024| Confidential. ASICS: ~3x faster growth than general purpose chips, driven by IT/OT integration. Global ASIC. Market 2031. $51.0 Bn. Global. Market 2023...
Semiconductor. assembly & test. Front end. fabrication. R&D and Design. Design and architecture. of ICs for end use. applications. Manufacturing of silicon. wafer of varying. thickness. Encapsulation and. testing of individual ICs. cut from wafer. play 1 abrication. R&D and Design. Design and architecture. of ICs for end use. applications. Manufacturing of silicon. wafer of varying. thickness.
Crafting reliable circuits for robust performance. Custom Cables & Harnesses. Bespoke wiring solutions for your unique needs. 12INVESTOR PRESENTATION ms and. smooth performance. Thru-Hole PCB Assembly. Crafting reliable circuits for robust performance. Custom Cables & Harnesses. Bespoke wiring solutions for your unique needs. 12INVESTOR PRESENTATION. MANUFACTURING. PROCESS. Raw Material Sourcing.
This approach. emphasizes predictive maintenance, equipment analysis, and leveraging insights from generative AI to enhance manufacturing. processes. As the demand for sophisticated Generative AI chips grows, there is an increase in the adoption of advanced packaging. and testing technologies such as 2.5D and 3D integration. anufacturing. processes.
In-house R&D team for electronics hardware designing,. system architecture, mechanical design, and component. engineering to assist customers in cost reduction. through product engineering. . Manufacturing facility in SEZ Zone at 68AA, NSEZ, Noida,. Uttar Pradesh. . Facility has four SMT lines equipped with SPI’s & AOI’s,. lead free wave soldering machine, PCBA router, high.
OUR PRECISION. ENGINEERING FORTRESS. State-of-the-art facilities. 17. PUNE R&D & CCS PROJECT (EST. shop. . Inhouse R&D and Innovation. . Inhouse Reliability Testing. . Inhouse Tooling and Design. 16. 06.b. OUR PRECISION. ENGINEERING FORTRESS. State-of-the-art facilities. 17. PUNE R&D & CCS PROJECT (EST. 2026). 06.c. Purpose-built for forward integration into higher-value.
Advanced semiconductor. packaging unit. . Design+ capabilities along with. semiconductor manufacturing. . Breakthrough in Silicon. Photonics package assembly. . High growth potential with. support from Make in India ed semiconductor. packaging unit. . Design+ capabilities along with. semiconductor manufacturing. . Breakthrough in Silicon. Photonics package assembly. . High growth potential with.