Semiconductor Chip Packaging & OSAT

8 companies Updated 3 Sept 2026

NSE-listed companies building India's semiconductor packaging and OSAT ecosystem — from greenfield assembly-and-test facilities to fabless ASIC design houses and advanced packaging specialists.

Sectors represented: Capital Goods, Information Technology

Companies with exposure to semiconductor chip packaging & osat

KAYNES

Kaynes Technology India Limited

Capital Goods
investor presentation · 2024

Inner Layer Manufacturing Process. Outer Layer ImagePattern PlateEtchingVia Hole PluggingSoldermaskSurface Finish. Outer Layer Manufacturing Process. Removing the unwanted. copper from the panel. The inner layers are. “stacked” together with ter Layer ImagePattern PlateEtchingVia Hole PluggingSoldermaskSurface Finish. Outer Layer Manufacturing Process. Removing the unwanted. copper from the panel.

CYIENT

Cyient Limited

Information Technology
investor presentation · 2024

The market size & growth. 2 sectors. $200Bn+investedinU.S.semiconductor. capacity,bolsteredbyglobalgovernment. supportandmajorfabinvestments. The recovery of semiconductor market after periodic downturns. The market size & growth. 2. © CYIENT 2024| Confidential. ASICS: ~3x faster growth than general purpose chips, driven by IT/OT integration. Global ASIC. Market 2031. $51.0 Bn. Global. Market 2023...

SAHASRA

Sahasra Electronic Solutions Limited

Capital Goods
investor presentation · 2026

MACHINES - TESTING AN ROOM ENVIRONMENT. MACHINES – CLASS10K. (FRONT OF THE LINE). MACHINES – CLASS100K. (END OF THE LINE). CONFIDENTIAL – SAHASRA GROUP. CONFIDENTIAL – SAHASRA GROUP. MACHINES - TESTING. Quality is an integral part of the. product at Sahasra. Semiconductors, to ensure the. same we have the latest state of. the art equipment for the testing. of the product before it is. shipped.

CGPOWER

CG Power and Industrial Solutions Limited

Capital Goods
investor presentation · 2025

Semiconductor. assembly & test. Front end. fabrication. R&D and Design. Design and architecture. of ICs for end use. applications. Manufacturing of silicon. wafer of varying. thickness. Encapsulation and. testing of individual ICs. cut from wafer. play 1 abrication. R&D and Design. Design and architecture. of ICs for end use. applications. Manufacturing of silicon. wafer of varying. thickness.

AIMTRON

Aimtron Electronics Limited

Capital Goods
investor presentation · 2024

Crafting reliable circuits for robust performance. Custom Cables & Harnesses. Bespoke wiring solutions for your unique needs. 12INVESTOR PRESENTATION ms and. smooth performance. Thru-Hole PCB Assembly. Crafting reliable circuits for robust performance. Custom Cables & Harnesses. Bespoke wiring solutions for your unique needs. 12INVESTOR PRESENTATION. MANUFACTURING. PROCESS. Raw Material Sourcing.

MOSCHIP

Moschip Technologies Limited

Information Technology
annual report · 2026

MosChip supports customers across discrete semiconductor design engagements and lull-cycle turnkey. programmes. SINESS UMI rs. 0. Silicon Engineering Services. . . 0. From specification to validated silicon. MosChip supports customers across discrete semiconductor design engagements and lull-cycle turnkey. programmes.

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